壓痕測試法的新發展

K.赫爾曼[1] 王蘭州[2]（翻譯/整理）
[1]德國聯邦物理技術研究院,德國 布倫瑞克市 [2]不詳
摘　要:介紹了壓痕測試法的最新發展,指出了確定超薄薄膜t＜10 nm及很硬的薄膜t＜100 nm的硬度及模量是對計量學中納米范圍的挑戰.以壓痕測試法替代顯微維氏實驗可顯著地降低測量不確定度及實現自動化.壓痕測試法在納米范圍及顯微范圍內可為微電子學、微電機械系統、技術光學等領域采用.[著者文摘]

New developments of the instrumented indentation testK. Herrmann Physikaliseh-Teehnisehe Bundesanstalt Braunscheig, GermanyAbstract:An advance of the instrumented indentation test （IIT） in recent years has been introduced in this work. It indicates a metrological challenge in the nano range-determination of hardness and modulus on ultrathin layers t〈10 nm and of very hard layers t~100 nm. Substitution of micro Vickers test by IIT enables signifi- cant reduction of measurement uncertainty and automatization. IIT in nano and micro ranges provides manifold applications for microelectronics, MEMS, technical optics, etc.[著者文摘]

Key words:indentation, the instrumented indentation test （IIT） ; uncertainty; metrology